Multi-chip CDMA-based handsets seem to exhibit problems with signal fluctuations and internal heating. The single-chip solutions from Qualcomm are better, but also seem to suffer from a heat problem. Is there a solution?
We have come a long way from the days when a family could snuggle around a glowing vacuum tube for warmth, although today's crop of smaller technology devices do struggle with the same (although less nostalgic) heating problem. Basically, as chips become smaller, more dense and able to carry more bits and bytes of data there is a significant problem involving heat dispensation. You can't equip cellular handsets with fans, given the size of the device and the drain it would put on batteries. So, vendors have come up with a lot of neat ways to layer chips and change the design of phones and small devices that permit air to flow over these devices and reduce the heat problem. Also, new-generation chips -- such as Intel Corp.'s Centrino -- are specifically designed for mobile and wireless operations, and automatically scale the power requirements to minimize the heat problem. One good application of this technology and design is in the new Tablet PC computers available from Motion Computing, Inc.
Qualcomm, Inc. obviously has a vested interest developing lower-power chipsets that support CDMA technology, since the company developed and licenses the technology worldwide. Most recently, the company started shipping high-speed CDMA2000 ixEV-DO chipsets to developers, and supporting services were launched this March in San Diego and Washington, D.C. These chipsets are designed for more demanding enterprise-class applications, as well extended low-power and low-heat operations.